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Education: BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field Work Experience: At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and
About HOYA Founded in 1941 in Tokyo, Japan, Hoya is a global med-tech company, and a leading supplier of innovative high-tech and medical products. Hoya is active in the fields of healthcare and information technology providing
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