Job Summary: An assembly process engineer develops, monitors, and optimizes post-wafer manufacturing operations—such as wafer dicing, chip packaging, wire bonding, and final testing. They troubleshoot assembly line defects, improve production yield, and test new packaging materials to ensure high
Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and
Job Description Test Strategy & Development Develop cost-effective and high-efficiency test solutions for GaN and Silicon device families. Create, debug, and release test programs on discrete testers and mixed signal ATE platforms. Lead the transition of legacy
Job Title: IT Application Engineer Physical Security Systems (OnGuard / Genetec Specialty) Position Summary: This IT Application Engineer will be responsible for the deployment, upgrade, maintenance, and modernization of enterprise-level Physical Security Applications, with primary responsibility for Lenel
Education: BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field Work Experience: At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead