Primary Duties & Responsibilities Responsible for managingthe product lifecycle by supporting product development, new product introduction (NPI), production ramp-up, sustaining engineering, and product changes throughout the product lifecycle Drive product performance by monitoring product yield, quality,
The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across
We are seeking great talent to help us build The DNA of tech.® Vishay manufactures one of the worlds largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the
We are seeking a highly motivated Product Engineer (Sustaining) to support the manufacturing, quality, reliability, and continuous improvement of Power MOSFET products. The engineer will work closely with cross-functional teams across Wafer Fab, Assembly, Test, Quality,
Office location: Metro Manila Work setup: Full Onsite (Must be willing to travel) Role Overview The Senior Process Engineer will lead process engineering activities throughout the lifecycle of floating seawater desalination projects, from process design and
Office location: Metro Manila Work setup: Full Onsite (Must be willing to travel) Role Overview The Senior Process Engineer will lead process engineering activities throughout the lifecycle of floating seawater desalination projects, from process design and
Microchip’s rapidly expanding Analog business is seeking a Senior Product Engineer to accelerate new product introductions. You will join the Mixed Signal and Linear Division Analog Product Engineering team and collaborate closely with other engineering disciplines within
Microchip’s rapidly expanding Analog business is seeking a Senior Product Engineer to accelerate new product introductions. You will join the Mixed Signal and Linear Division Analog Product Engineering team and collaborate closely with other engineering disciplines within
Education: BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field Work Experience: At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead