About the Role The Equipment Engineer supports manufacturing operations through the development, optimization, qualification, and maintenance of Die Attach/Clip Attach (DACA) equipment. This role is responsible for improving equipment reliability, availability, and performance while supporting new
Job Description Develop, implement, and continuously improve SMT manufacturing processes to achieve quality, productivity, and cost objectives. Optimize SMT process parameters including solder paste printing, SPI, pick-and-place placement, reflow soldering, and AOI inspection. Monitor and improve Overall
(Back of Line) Graduate of BS ECE, EE, or any related course. With hands-on experience in manual soldering, rework, and repair of PCBs. With experience in process improvement, yield improvement, and defect reduction. Ability to work
Graduate of BS ECE, BS EE, BS ME. With 2-4 years’ experience in SMT process and machines. Knowledgeable in Paste Printer (Yamaha, Panasonic), Chip Mounter (Yamaha), Reflow, AOI troubleshooting, and repair. Experience in any of the following
Qualifications * Bachelor’s degree in Electronics Engineering, Electrical Engineering, Manufacturing Engineering, or a related field * 3–5 years of experience in SMT or PCB assembly manufacturing * Strong knowledge of SMT processes, materials, and equipment *