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Primary Duties & Responsibilities Process Development & Optimization Develop, optimize, and deploy die bonding and wire bonding processes resulting to high reliability Establish process parameters for die attach specific for eutectic die bonding and wire bonding applications Improve assembly yield, reliability, cycle
Job Summary: An assembly process engineer develops, monitors, and optimizes post-wafer manufacturing operations—such as wafer dicing, chip packaging, wire bonding, and final testing. They troubleshoot assembly line defects, improve production yield, and test new packaging materials to ensure
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